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toby
toby
Associate II
November 17, 2015
Question

SPWF01SA PCB Footprint

  • November 17, 2015
  • 3 replies
  • 863 views
Posted on November 17, 2015 at 15:05

Between the rev 4 & Rev 6 datasheets there seems to have been a change in the centre pad size on the recommended footprint.  It now seems to ask for 8mm max x6mm max - previously it was specified as 10mmx8mm!  I have based all my designs on the larger pad.

The datasheet revision history does not seem to mention this change.  When did it come in? Has there been a revison change on the module?

#spwf01sa
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    3 replies

    Gerardo GALLUCCI
    Gerardo GALLUCCI
    ST Employee
    November 17, 2015
    Posted on November 17, 2015 at 15:43

    Hi Toby,

    changes took place in Rev5.

    Module's HW did not change. I mean, there was only a mismatch on picture number 7. Pad size was (and is still) 8x6mm.

    Normally solder paste takes 80% of pad layout. You can reduce this percentage to 60%.

    Regards

    jerry

    toby
    tobyAuthor
    Associate II
    November 17, 2015
    Posted on November 17, 2015 at 15:53

    Ok thanks for the info.  I will have to update my footprint to match for the next production boards. 

    Unfortunately then I assume that then there is potentially a risk of shorts then with the larger pad and our current production assemblies?

    Gerardo GALLUCCI
    Gerardo GALLUCCI
    ST Employee
    November 17, 2015
    Posted on November 17, 2015 at 16:03

    Within 60% there are no risks, because of solder resist (vias are ok)

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